Workshop on

Large Language Models for Multimodal Data Fusion

📍 Shenyang, China, November 12-15, 2026

🤝 Held as part of the IEEE International Conference on Data Mining (IEEE ICDM 2026)

📅 November 2026

Find out more

About the workshop

The Workshop on Large Language Models for Multimodal Data Fusion (LLM4MDF) is a specialized, in-depth forum collocated with the IEEE International Conference on Data Mining (ICDM). It targets the emerging intersection of large language models (LLMs), multimodal learning, and data fusion, which are high-impact directions aligned with the core mission to advance data mining theory, algorithms, and applications.

LLM4MDF focuses on LLM-driven fusion of text, images, audio, video, time series, graphs, and sensor data, bridging semantic understanding and heterogeneous data integration.

This workshop directly extends the scope of ICDM on multimodal data mining, heterogeneous data integration, and large-model-driven knowledge discovery. It complements the main conference by fostering cross-community collaboration on LLM-powered multimodal fusion, addressing critical challenges in unifying diverse data types for reliable, interpretable, and scalable data mining.

By bringing together researchers and practitioners, LLM4MDF drives state-of-the-art advances in multimodal data mining and supports the goal of shaping the future of data science.

Themes and topics

We explore how large language models can be leveraged to fuse and mine heterogeneous multimodal data sources, investigating emerging approaches that are reliable, interpretable, and scalable.

Topics of interest include, but are not limited to:
  • LLM-based multimodal data representation, alignment, and fusion architectures.
  • Dynamic, adaptive, and interpretable multimodal data fusion mechanisms.
  • Multimodal knowledge extraction, reasoning, and generation.
  • Scalable, efficient, and robust multimodal data fusion systems.
  • Real-world multimodal data fusion applications.
Shenyang, China

Where

IEEE ICDM 2026

Co-located

November 12-15, 2026

When

Submissions

SUBMISSION GUIDELINES

Important dates
  • Paper submission due: August 20, 2026
  • Notification: September 18, 2026
  • Camera-ready: October 5, 2026

What to submit

We welcome the following types of submissions:
  • Regular papers Authors are invited to submit original papers, which have not been published elsewhere and which are not currently under consideration for another journal, conference or workshop. Manuscripts must be submitted electronically through the online submission system. Paper should be limited to a maximum of ten (10) pages, in the IEEE 2-column format (https://www.ieee.org/conferences/publishing/templates.html), including the references and any possible appendices. Submissions longer than 10 pages will be rejected without review. All submissions will be triple-blind reviewed by the Program Committee on the basis of technical quality, relevance to scope of the conference, originality, significance, and clarity. The following sections give further information for authors.

How to submit

  • Formatting and submission: Please follow the submission guideline from the ICDM 2026 Submission Website.

Program

CHECK OUR PROGRAM

Tentative program (TBD)

Organization

ORGANIZERS

Weiwei Jiang

Beijing University of Posts and Telecommunications, China

Ahmad Taher Azar

Prince Sultan University, Saudi Arabia

Muhammet Deveci

University College London, UK

Stefano Cirillo

University of Salerno, Italy

PROGRAM COMMITTEE

Sai Huang, Beijing University of Posts and Telecommunications, China
Dingyou Ma, Beijing University of Posts and Telecommunications, China
Yixin He, Jiaxing University, China
Serena Tardelli, IIT-CNR, Italy
Andrea Mauri, Université Claude Bernard Lyon 1, France
Giandomenico Solimando, University of Salerno, Italy
Gaetano Cimino, University of Salerno, Italy
Eliana Pastor, Polytechnic University of Turin, Italy
Gianluca Bonifazi, Marche Polytechnic University, Italy
Maurizio Atzori, University of Cagliari, Italy
Luca Zecchini, Technische Universität Berlin, Germany
Gerardo Vitagliano, MIT, USA
Luca Virgili, Marche Polytechnic University, Italy
Weifeng Zhu, Guangdong Baiyun University, China
Wenping Song, National University of Defense Technology, China
Jianbin Mu, Zhejiang University of Technology, China
Miao He, Yanqi Lake Beijing Institute of Mathematical Sciences and Applications, China
Weixi Gu, China Academy of Industrial Internet, China
Shun Li, Ocean University of China, China
Xuedong Li, Beihang University, China
Shams ur Rehman, HITEC University Taxila, Pakistan
Ramanathan Lakshmanan, Vellore Institute of Technology, India
Muhammad Arslan Akram, Centre for Secure Information Technologies (CSIT), United Kingdom
Muhammad Awais Javeed, Southeast University, China
Mohammed Amin Almaiah, The University of Jordan, Jordan
Momina Shaheen, University of Roehampton, United Kingdom
Tanveer Ahmad, University of Cyprus, Cyprus
Arshad Khan, Yoobee College of Creative Innovation, New Zealand
Yahya Fikri, Abdelmalek Essaadi University, Morocco
Logeshwaran Jaganathan, Christ University, Bengaluru, India
Mohammed Zakariah, King Saud University, Saudi Arabia
Danish Jamil, Sir Syed University of Engineering and Technology, Pakistan
Muhammad Asghar Khan, Prince Mohammad Bin Fahd University, Saudi Arabia
Rajesh Kumar Dhanaraj, Symbiosis International (Deemed University), India
Tai Fei, Dortmund University of Applied Sciences and Arts, Germany
M. Shahid Anwar, King Fahd University of Petroleum and Minerals, KSA
Bhanuprakash Madupati, Department of Corrections, USA
Anurag Satpathy, Missouri University of Science and Technology, USA
Vinayakumar Ravi, Prince Mohammad Bin Fahd University, Saudi Arabia
Surjeet Dalal, Amity University Haryana, India
Noha Hassan, Toronto Metropolitan University, Canada
Muhammad Baqer Mollah, University of Houston, Texas, USA
Alak Majumder, National Institute of Technology (NIT), Arunachal Pradesh, India